PCB工艺能力参数
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项目 |
参数 |
备注 |
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|---|---|---|---|---|---|
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最小线宽 |
2.7 |
Finished product copper thickness 0.5 OZ |
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最新线距 |
3 |
Finished product copper thickness 0.5 OZ |
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最小焊环 |
过孔: 3mil |
Distance between hole edge to ring outskirt |
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器件孔: 5mil |
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最小过孔 |
板厚 <2.0mm |
0.2mm |
Finished product |
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板厚 <1.2mm |
0.1mm |
Finished product |
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板厚≥2.0mm |
Aspect Ratio≤10 |
Finished product |
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最大板厚 |
单双面板 |
8.0mm |
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多层板 |
8.0mm |
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最小板厚 |
单双面板 |
0.2mm |
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4层板 |
0.4mm |
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6层板 |
0.6mm |
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8层板 |
1.0mm |
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10层板 |
1.2mm |
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最大PCB 尺寸 |
单双面板 |
609x609mm |
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多层板 |
550x810mm |
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线路到板边的距离 |
V-CUT:0.4mm |
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V-CUT:0.33mm(Board Thickness<1.2mm) |
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最大层数 |
30 Layers |
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|
阻焊 |
开窗(mil) |
2~4 |
2mil is allowed for mask bridge |
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绿油桥(mil) |
6 |
Between IC pins |
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|
颜色 |
绿色、蓝色、红色、黑色、白色 |
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字符 |
字符宽度(mil) |
5~8 |
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颜色 |
白色，黄色，黑色，灰色 |
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表面处理 |
喷锡，沉金，镍钯金，OSP，沉锡，沉银 |
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|
镀层厚度(microinch) |
表面处理 |
镀层 |
最小 |
最大 |
|
|
镀镍金 |
Ni Thickness |
100 |
150 |
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|
Au Thickness |
1 |
3 |
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|
沉镍金 |
Ni Thickness |
100 |
150 |
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|
Au Thickness |
1 |
3 |
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金手指 |
Ni Thickness |
120 |
150 |
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|
Au Thickness |
5 |
30 |
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镀铜厚度(micron) |
Copper Thickness |
20 |
25 |
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|
基铜厚度 |
内外层 |
0.5 |
6 |
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完成铜厚 |
外层 |
1 |
6.5 |
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内层 |
0.5 |
6 |
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绝缘层 |
0.06 |
---- |
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线宽线距(mil) |
铜厚 |
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|
2.7/3, 4/4, 4/5 |
0.5 oz |
Line width shouldn’t be less than the required value under ensure of space. |
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4/6, 5/5, 6/5 |
1 oz |
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5/6, 6/6 |
2 oz |
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6/8, 7/8, 8/8 |
3 oz |
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8/10, 9/10, 10/10 |
5 oz |
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PCB板的材料 |
FR-4;Aluminium Base;High Tg;PTFE;Heavy Copper;Paper Base;Rogers,CEM |
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PCB板的外形公差 |
完成板厚工厂 |
阻抗控制公差 |
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L≤100mm:±0.1mm |
H≤1.0 mm: ±0.1mm |
±10% |
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100mm<L≤200mm: ±0.13 mm |
1.0mm<H≤1.6 mm: ±0.14mm |
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200mm<L≤300mm: ±0.2 mm |
1.6mm<H≤2.0mm: ±0.18mm |
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300mm<L≤……±0.2 mm |
2.0mm<H≤2.4 mm: ±0.22mm |
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2.4mm<H≤3.0 mm: ±0.25mm |
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3.0mm<H≤……: ±10% |
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