层数:2层 PCB材料:ADH 20um/PI 25um RA 板厚:0.24mm 表面处理:ENIG 成品铜厚度:1/1oz 最小迹线宽度/间距:4/4mil 最小过孔:0.3mm 简介:激光成型 FR4加强筋
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